Desmia device
Remove smears after drilling holes such as blind vias and through holes with a laser drill!
SETO ENGINEERING Co., Ltd. handles the "Desmia Device." This device can remove smears after drilling blind vias and through holes using laser drills and other methods. The line configuration is single-lane, and the processing surface is double-sided. The device configuration includes unwinding, degreasing, etching, neutralization and reduction, pure water washing, liquid draining, drying, and winding. 【Specifications】 ■ Line configuration: 1 lane ■ Transport speed: 0.5 to 1.0 m/min (depending on specifications) ■ Material width: 70 mm to 160 mm (for FPC, 250 to 300 mm) ■ Material thickness: PI 25 μm and above ■ Processing surface: double-sided *For more details, please refer to the PDF document or feel free to contact us.
- Company：SETO ENGINEERING 守谷事業所
- Price：Other
